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SK Hynix Pumps Billions into U.S. AI Semiconductor Production

Daniel Kim Views  

President and CEO of SK Hynix, Kwak No-Jung (Newsis)

SK Hynix’s CEO, Kwak Noh Jung, emphasized the importance of semiconductor cooperation with the U.S. On the 17th (local time), Kwak delivered a keynote speech on the ‘Partnership for Global Success in the AI Era’ theme at the ‘Chips for America: Execution for Global Success’ event in Washington, DC.

He explained that the potential of AI technology, which is just starting to emerge, is infinite and that “SK Hynix is continuously developing advanced technology to meet market demand in areas such as generative AI.”

Kwak introduced the company’s plans to invest in the U.S., stating that SK Hynix is striving to enhance the manufacturing capabilities needed for the future.

On the 4th, SK Hynix announced plans to invest 5.2 trillion won ($4.4 billion) in Indiana to build a production base for next-generation high-bandwidth memory (HBM), a core component of AI semiconductors. SK Hynix plans to construct an advanced packaging production base for AI memory in West Lafayette, Indiana, and collaborate with local research institutions, such as Purdue University, on semiconductor research and development.

President Kwak emphasized, “I am confident that this investment can realize the aspirations of our company, Purdue University, the U.S. government, and the state of Indiana.” Purdue University in Indiana hosted the event alongside Senator Todd Young, representing the area. Industry, government, and academic representatives attended to discuss strengthening U.S. competitiveness in semiconductor research and development and human resources.

Daniel Kim
content@viewusglobal.com

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