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Jensen Huang, CEO of the American semiconductor company NVIDIA, tested Samsung’s HBM (High-Bandwidth Memory) and expressed high expectations at a global media roundtable on the 19th (local time).
NVIDIA revealed that they had previously been supplied with HBM from SK Hynix and Micron but are now testing Samsung’s HBM.
HBM is a high-performance product essential for powering generative AI, significantly improving data processing speed.
NVIDIA’s next-generation AI chip, Blackwell, is expected to be equipped with the latest HBM3E. It is currently using products from SK Hynix and Micron.
SK Hynix announced that it will be the first in the world to mass-produce HBM3E and will supply customers with it by the end of this month.
SK Hynix is currently evaluated to be about a year ahead of Samsung in the global HBM market.
After NVIDIA’s verification test is finalized, Samsung is expected to secure its place as another supplier for NVIDIA, following SK Hynix.
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