Apple reportedly partners with American semiconductor giant Broadcom to develop server chips designed for artificial intelligence (AI) processing.
According to The Information, the project involves a chip under development codenamed Baltra.
The chip will be produced using Taiwan Semiconductor Manufacturing Company’s (TSMC) advanced 3-nanometer (N3P) process, with mass production targeted for 2026.
Broadcom is a global leader in semiconductor and infrastructure software solutions. It specializes in designing high-performance semiconductors and software products for diverse industries and is ranked 10th in market capitalization on the New York Stock Exchange.
In May last year, Apple signed a multi-year, multi-billion-dollar agreement with Broadcom to co-develop 5G radio frequency (RF) components and next-generation wireless access technology.
Industry experts view Apple’s initiative to create its own AI chips as a strategic move to reduce reliance on NVIDIA, which currently holds over 80% of the global AI chip market.
At its June Worldwide Developers Conference (WWDC), Apple revealed plans to power AI functionalities using proprietary server chips.
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